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Okamoto Model OGM-12.24U CNC Universal Cylindrical Grinder(1995) Specifications and Equipment Swing Over Covers: 12.60" Distance Between Centers: 23.62" Grinding Wheel Diameter: 14" Capacity Between Centers: 330 LB, Wheelhead Motor: 7.5HP, Workhead Motor: 1HP, Wheel Speed: 1845 RPM, Longitudinal Feeds: 29.5- 400 IPM, Equipped With: Internal ...
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Okamoto extabilished Singapole subsidiary Okamoto (Singapore) Pte, Ltd in Singapore. 1982: Okamoto's Annaka Plant in Gunma Prefecture completed. 1987: ... Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher. 2002: Okamoto estabilished subsidiary Okamoto (Shanghai) Co.,Ltd. ...
WhatsApp:+8617329420102
Buy and sell used and refurbished semiconductor equipment at used semiconductor equipment marketplace SurplusGlobal, SurplusGlobal serves various semiconductor manufacturing equipment such as used Amat CVD/endura, Tel Litius, Implanter, Lam 2300, Metrology equipment, Wire Bonder, ASML Stepper, etc.
WhatsApp:+8617329420102
Satoh T, Okamoto SI, Cui J, Watanabe Y, Furuta K, Suzuki M, Tohyama K, Lipton SA. Activation of the Keap1/Nrf2 pathway for neuroprotection by electrophilic [correction of electrophillic] phase II inducers. Proc Natl Acad Sci U S A. 2006; 103:768-773. [PMC free article] [Google Scholar] Seo YJ, Lee JW, Lee EH, Lee HK, Kim HW, Kim YH.
WhatsApp:+8617329420102
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HEIDENHAIN is at home in numerous industries. Discover solutions from the HEIDENHAIN Corporate Group for your application. Discuss your requirements with our sales engineers, and let our brands support your market success with their extensive product portfolios and strong industry expertise. Your applications are demanding.
WhatsApp:+8617329420102
OKAMOTO GNX 300P Products OKAMOTO: GNX 300P Details, Back grinder, 8"-12", OKAMOTO: GNX 200 Details ID#: 9080843... Read More. Wanted Okamoto GNX200 Back Grinder - EquipMatching. Wanted Okamoto GNX200 Back Grinder Posted by: Login or Register Location:, Looking for 1 set Okamoto GNX200 Back Grinder in working condition....
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Feature. ・Brittle material manual grinder for R&D purpose SVG101 series has shuttle table and easy to put the wafer on/off. ・VG401 series has high rigid spindle design and high power built in motor, which is enable to continuous grinding for brittle material like sapphire and SiC or compound material. MAX φ450mm wafer chuck table is ...
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[Sold] Okamoto SVG-502 MKII Back Grinder Sold. Item No SG15280; Category Packaging; Vintage 1996; Wafer Size 8 ... Sold. Contact Info SurplusGLOBAL, USA +1-408-436-5347 Email Product Specialist Leo Choi +82-31-728-1400 Email. Recommendations [SG34050] SUSSMicroTec CB200M Wafer Bonder Packaging [SG34049] SUSSMicroTec CBC200 Wafer Bonder ...
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